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Bus interface – Bus by which the graphics processor is attached to the system (typically an expansion slot, such as PCI, AGP, or PCIe).TBP (Typical board power) – Typical power drawn by the total board, including power for the GPU chip and peripheral equipment, such as Voltage regulator module, memory, fans, etc., measured in Watt.TDP ( Thermal design power) – Maximum amount of heat generated by the GPU chip, measured in Watt.Bandwidth – Maximum theoretical memory bandwidth based on bus type and width.Clock – The reference memory clock frequency.Bus width – Maximum bit width of the memory bus utilized.Bus type – Type of memory bus utilized.Vertex operations - The amount of geometry operations that can be processed on the vertex shaders in one second (only applies to Direct3D 9.0c and older GPUs).Shader operations - How many operations the pixel shaders (or unified shaders in Direct3D 10 and newer GPUs) can perform.Texture - The rate at which textures can be mapped by the texture mapping units onto a polygon mesh.Pixel - The rate at which pixels can be rendered by the raster operators to a display.Core clock – The reference base and boost (if available) core clock frequency.Core config – The layout of the graphics pipeline, in terms of functional units.Die size – Physical surface area of the die.Transistors – Number of transistors on the die.Average feature size of components of the GPU. Architecture – The microarchitecture used by the GPU.Codename – The internal engineering codename for the GPU.Note that ATI trademarks have been replaced by AMD trademarks starting with the Radeon HD 6000 series for desktop and AMD FirePro series for professional graphics. Model – The marketing name for the GPU assigned by AMD/ ATI.The headers in the table listed below describe the following:

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